Modify upstream thermal framework to work well on non-ACPI platforms
Write a cpufreq cooling device that caps the frequency: TODO
Extend OMAP hwmon driver to register as a sensor with thermal framework: TODO
Blueprint information
- Status:
- Complete
- Approver:
- Amit Kucheria
- Priority:
- High
- Drafter:
- Amit Kucheria
- Direction:
- Approved
- Assignee:
- Amit Daniel Kachhap
- Definition:
- New
- Series goal:
- Accepted for trunk
- Implementation:
-
Implemented
- Milestone target:
-
2011.12
- Started by
- Amit Kucheria
- Completed by
- Mounir Bsaibes
Related branches
Related bugs
Sprints
Whiteboard
Meta:
Headline: Fix the thermal framework to be more useful on ARM platforms
Acceptance: Samsung boards boot correctly, the drivers function correctly and pass thermal tests.
Roadmap id: PMWG2011-
[amitdanielk] Test that temperature is reduced in production using the current solution-done on origen board: DONE
[amitdanielk] Added and posted the patch for a new trip type needed for cooling devices like cpufreq: DONE
[amitdanielk] Adding a generic processor cooling devices(non ACPI based, for ACPI already exists): DONE
moved to https:/
Write a cpufreq cooling device that caps the frequency: TODO
Extend OMAP hwmon driver to register as a sensor with thermal framework: TODO
Work with TI Landing team to test thermal management solution on OMAP: TODO
Remove ACPI'isms and send to mainline(this workitem to be broken into smaller workitem): INPROGRESS
Some modifications found after review like make the exynos layer expose registration api's and make it instance based which will make multiple sensor registration possible: INPROGRESS.
Use the temperature information in thermal layer to generate some useful information like temperature drop per trip type : TODO
Work Items
Dependency tree

* Blueprints in grey have been implemented.